Application of ozone in semiconductor industry

In the semiconductor industry, ozone plays an integral and critical role. As a high-efficiency cleaning and disinfection gas, it is widely used in the manufacturing process of core components such as body tubes and integrated circuits. Ozone produces free radicals and oxygen molecules through decomposition. These active substances can effectively remove organic matter attached to the surface and kill microorganisms, thus significantly improving the electrical performance and stability of the product. In transistor fabrication, ozone ensures surface cleanliness and charge response stability; In the manufacture of integrated circuits, it forms a protective layer to prevent the material from being contaminated.

The application of ozone can be divided into the following aspects:

1. Wet cleaning: The strong oxidation properties of ozone in the water phase are used to oxidize and remove organic and metal pollutants from the wafer surface. This method can effectively remove tiny traces of contamination that can cause structural changes in the wafer surface area.

2. Dry cleaning: In addition to wet cleaning, ozone is also used in the dry cleaning process, which helps to further improve the cleaning effect and efficiency.

3. Chemical vapor deposition (CVD): In the chemical vapor deposition process, oxygen acts as an oxidizing agent and is able to react with gaseous precursors to help form high-quality films on the surface of the substrate.

4. Photoresist removal: Ozone is also used as an alternative to traditional wet cleaning and photoresist removal methods because it is more economical and environmentally friendly than RCA clean technology.